Curing Oven

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Industrial Curing Ovens are used by thermal processing specialists to improve the strength and durability of a material by applying heat to accelerate a desirable chemical reaction.

Usage: semiconductor packaging program segment, for resin curing

Available in 2/4/6-chamber combinations (independent control for each chamber).

Space saving.

Horizontal convection.

Fast temperature rising and cooling, with program operation function.

Equipped with auto lock, N2 flowmeter, temperature recorder, emergency stop switch, etc.

Equipped with safety devices of auto overheat protector, overheat protector, abnormal N2 pressure, abnormal N2 flow, over-current earth leakage circuit breaker, etc.

  • - semiconductor packaging program segment, for resin curing
Technical specifications
Operating temperature range
Temperature adjustment accuracy
±5.0°C (at 175°C)
Temperature rising time
15 min (50°C→175°C)
Temperature cooling time
30min (175°C→50°C)
Operation function
Fixed temp., program operation
Air exhaust actuator, N2 introduction device, recorder, etc.
Internal dimension (WxDxH) - single chamber
450 mm x 520 mm x 300 mm
Power source
3 phase AC380V 6A